Faculty

Assistant Professor
Gun-Hee Lee
+82-52-217-2757 gunheel@unist.ac.kr Rm 701-14, Bldg 110
  • Bio-Integrated Machines Lab
  • Human-Machine interfaces, Smart apparel, Soft robotics, Wearable robots for rehabilitations.

REHABILATION&REGENERATIVE ENGINEERING

In the Bio-Integrated Machines Laboratory, we develop smart devices and machines that can be directly integrated with the human body for health monitoring, biomedical treatment, and human–machine interaction. To achieve this goal, we design and fabricate soft and stretchable electronic systems using advanced solution-based manufacturing approaches, including printing technologies. By integrating these bio-integrated machines with cutting-edge signal processing circuits and artificial intelligence, we aim to enable a new paradigm of ubiquitous and personalized healthcare.

Curriculum Vitae

  • –2026.03: Assistant Professor, UNIST(BME)
  • –2025~2026: Assistant Professor, Pusan National University
  • –2024~2025: Postdoctoral Researcher, Carnegie Mellon University (Prof. Carmel Majidi)
  • –2023~2024: Postdoctoral Researcher, KAIST (Prof. SeongjunPark)

Academic Credential

  • –2023: Ph.D. Materials Science & Engineering, KAIST
  • –2018: B.S. Electrical & Electronic Engineering, Yonsei University

Awards

  • –POSCO Science Fellowship for Post Doc
  • -Outstanding Postdoctoral Scholar Award, 2023, KAIST Institute
  • -Best Ph. D. Dissertation Award in College of Engineering, KAIST

Publications

  • –“Meter-scale heterostructure printing for high-toughness fiber electrodes in intelligent digital apparel” Nature Communications, 16, 4320 (2025)
  • –“Phase-change metal Ink with pH-controlled chemical sintering for versatile and scalable fabrication of variable stiffness electronics”Science Advances, 11, eadv4921 (2025)
  • –“In situ sintering of ligand-bounded liquid metal particles in polymer matrix for soft bioelectronics Nature Communications, 16, 6220 (2025)
  • –“Rapid meniscus-guided printing of stable semi-solid-state liquid metal microgranular-particle for soft electronics” Nature Communications, 13, 2643 (2022)